Silicon CapacitorsETSC / EXSC Series

High temperature wire-bondable capacitor up to 250℃
The ETSC and EXSC series are designed to be compliant with high temperature wire bond technologies with Aluminum pads for Aluminum wedge bonding and gold pads on request for gold wire bonding. These capacitors feature low profile (250µm), low leakage current and high operating temperature (ETSC up to 200℃/ EXSC up to 250℃) with high stability with temperature, voltage and negligible capacitance loss through aging. Applications include downhole industries, decoupling, filtering, charge pump, replacement of X8R and C0G dielectrics, and high reliability applications, mainly for Multi-Chip Module assemblies.

Go here to confirm assembly notes for each product.

Key features

  • Ultra High operating temperature
    • - ETSC: up to 200℃
    • - EXSC: up to 250℃
  • Low profile (250µm)
  • High stability (temperature, voltage and aging)
  • Low leakage current
  • High reliability

(please refer to our assembly note for more details)

Key applications

  • All applications up to 250℃, such as aerospace, downhole and automotive industries
  • High reliability applications
  • Replacement of X7R/X8R and C0G dielectrics
  • Decoupling / Filtering / Charge pump(i.e.: motor management, temperature sensors)
  • Downsizing

ETSC / EXSC series Specification

Parameter Value
Capacitance range 390pF to 4.7µF
Capacitance tolerances ±15%(*)
Mounting Method Wire-bonding/ Embedded horizontal(*3)
Operating temperature range -55℃ to 200℃ for ETSC
-55℃ to 250℃ for EXSC
Storage temperature range -70℃ to 265℃(*2) for EXSC
Temperature coefficient +60ppm/K
Breakdown Voltage (BV) 11VDC or 30VDC
Capacitance variation versus RVDC 0.1%/V (from 0 to RVDC)
Insulation resistance 100GΩ @ 3V, @ 25℃, t>120s, for 100nF
Aging Negligible, < 0.001% / 1000h
Reliability FIT<0.017 parts / billions hours
Capacitor height 250µm
  • (*) Other values on request
  • (*2)w/o packing
  • (*3)Please check the assembly note for the mounting methods of each product.

ETSC Series

EXSC Series

Assembly Note

Please check the assembly note for the mounting methods of each product.

Assembly Note ETSC / EXSC_V1.9_Murata (PDF: 0.7 MB)


PDF Catalog

PDF documents related to silicon capacitors can be downloaded below

Commercial leaflet ETSC V4.6_Murata (PDF: 0.9 MB)


Commercial leaflet EXSC V4.4_Murata (PDF: 0.8 MB)