Multi-layer LCP product

Multi-layer LCP product is composed of two core technologies. These are Murata's core multilayer laminated technologies developed for MLCCs and a unique high-performance resin material.

Prepare the required number of layers of resin and copper foil-bonded sheets and then press them together at one time. The adhesive that has traditionally been used in resin substrates to adhere the sheets is not required in this step. As a result of this process, we are able to resolve many problems that were a challenge with the previous resin substrates.

Compared to the materials used in previous resin substrates (Glass Epoxy Substrate, FPC, etc.), the high-performance resin material possesses a smaller relative dielectric constant (εr), loss tangent (tanδ), and absorption rate.

As a result of these two technologies, you can manufacture not only a substrate, but also transmission lines and other components for smart phones and tablet devices, as well as composite components that combine antennas and matching circuits with Multi-layer LCP product.

Compared to previous resin materials, Multi-layer LCP product has a smaller relative dielectric constant and dielectric loss tangent, and it does not use adhesive to bond the layers in the multilayer substrate manufacturing process.
This makes it possible to achieve a substrate and components that have low loss in the high frequency range.
Low loss in the high frequency range indicates superior characteristics for recent applications to high-speed digital transmission.

This graph compares the loss of a Multi-layer LCP product transmission line with an FPC transmission line.
As you can see, Multi-layer LCP product is able to achieve low-loss products to contribute to low power consumption and improve communication performance in customer products.
It can also form more detailed electrode patterns compared to previous resin substrates.
In addition to reducing the thickness variation by not using adhesive between the layers, the formation of minute electrode patterns enables highly precise impedance control, which is important in the high frequency range and in high-speed digital transmission.

Multi-layer LCP product is cut out using laser cutting, which makes it possible to bend it in three dimensions and hold that shape to achieve complex 2D and 3D shape designs.

Multi-layer LCP product uses a single press for its multilayer lamination technology, which achieves a high-density and thin multilayer substrate.

The following three characteristics contribute to the high density.

The following four characteristics contribute to the thin profile.

Fusing all of these characteristics achieves a high-density, thin multilayer substrate that helps increase the degree of freedom that customers have in designing the interior of products and that saves space.

Compared to previous resin substrates (glass epoxy substrates, FR-4 substrates, FPC, etc.), Multi-layer LCP product uses a resin material with a low ratio of water and moisture absorption.
In addition, because adhesive is not required to bond the layers, high reliability products with high water and perspiration resistance can be achieved.

These graphs show the change in the resonance frequency before and after the high-temperature and high-humidity test conducted on both an antenna made with a Multi-layer LCP product and a conventional antenna made with FPC. We can confirm from the results that the characteristics of Multi-layer LCP product are much more stable than conventional FPC products. Such characteristics are one of the important parameters for products with mechanisms that resonate like antennas.