This product realizes an ultra-compact chip scale package (CSP) that incorporates the necessary load capacitance for the oscillation circuit. This enables a reduction in the total oscillation circuit space needed, which helps to reduce the final set size.
In addition, the open space can also be used to increase the battery size or add other functions.
The wafer level chip scale package (WLCSP) uses silicon materials that have high affinity when mounting with a semiconductor IC chip made of the same material. This enables embedding in the IC.
Transfer molding and wire bond mounting can also be supported.
The low ESR characteristics can be utilized to lower the IC gain.
This enables a reduction in the current consumption of the oscillation circuit and the power consumption of the overall set.
*Compared with our products